The Jipelec JetClip is a SEMI-MESC compatible Rapid Thermal Processing cluster module for wafer sizes up to 200 mm diameter. The water cooled, full metal-sealed, stainless steel chamber, with customized vacuum and gas systems, offers an ultra-clean environment for a large range of RTP and RTCVD processes.

The lamp furnace with its powerful electronics in association with the innovative pyrometer temperature measurement and the reactor design provides accurate temperature control and repeatable thermal behavior.

Jipelec PIMS PC control allows for full process monitoring, data acquisition and pyrometer calibration for a large range of substrates.

Robot handling unit and loadlock are available upon request. Stand alone systems can also be supplied.

Applications:		RTA: annealing, implant monitoring RTO: Rapid Thermal Oxidation RTN: Rapid Thermal Nitridation RTD: Rapid Thermal Diffusion for spin-on dopants Intrinsec ans doped Silicon and SiGe(C) Epitaxy Atmospheric pressure silicon deposition
Features:		Up to 200 mm wafers Full metal sealed cold wall chamber technology Pyrometer and thermocouple temperature control Atmospheric and vacuum process capability One purge gas line Up to 12 gas lines with MFC High vacuum capability
Performance:		Temperature range: ambient to 1200°C Ramp rate: 1°C/s to 200°C/s Pyrometer control: 250°C to 1200°C
Optional features:		Turbomolecular pumping unit Loadlock for manual loading Quartz cassette up to 13 wafers Robot Handling