JIPELEC’s new JetClip sg low temperature rapid thermal annealing (RTA) system utilizes an high power ultraviolet source to assist densification and crystallization for sol-gel, MOD and CSD processes. When used for ferroelectric and high-k materials such as PZT, SBT and BST, post annealing temperature can be reduced, a requirement in new generation devices.
This MESC compatible rapid thermal processing module handles wafers up to 200 mm. The system, as developed within the framework of the European Project, Brite Euram MUVAST. The project’s objectives are the development and acceleration of UV-assisted sol-gel technology processes for memory and sensor applications.
|
